Academic stress during the pandemic according to the sex, age, habitat and educational level of young Spaniards: A predictive model

Keywords: confinement, COVID-19, digitization, education, mental health

Abstract

In many societies, the coronavirus pandemic caused a change in the way of life, customs and, in particular, education. Taking young Spanish people, aged 15 to 29, as the study population, the objective of the research was to determine the predictive power of age, sex, habitat and education level on stress generated by the forced digitalization of education during the pandemic. Using a database developed by Reina Sofía Centre for Adolescence and Youth (FAD), a multiple regression analysis has carried out. The resulting model found that sex was a good predictor of the level of stress generated by digitized studies. The rest of the findings were counterintuitive as one would expect increased age, habitat and higher level of studies to be predictive of greater levels of stress. The results are contrasted with recent research on education.

Author Biography

Rebeca M. Durán Díaz, Complutense University of Madrid

Graduada en Magisterio de Educación Primaria por la Universidad de La Laguna. Especialista en Educación Musical. Máster en Investigación en Educación de la Universidad Complutense de Madrid. Alumna del Programa de Doctorado en Educación por la Universidad de La Laguna. Desarrolló sus estudios Profesionales de Interpretación en la Especialidad de Percusión y formó parte durante algunos años del Coro de Voces Blancas del Conservatorio Profesional de Música de Santa Cruz de Tenerife. Sus intereses giran en torno a la educación en entornos vulnerables y al estudio de variables asociadas a la mejora del rendimiento educativo.

View Citations

Metrics

Published
2022-05-09
How to Cite
Durán Díaz, R. M. (2022). Academic stress during the pandemic according to the sex, age, habitat and educational level of young Spaniards: A predictive model. Teknokultura. Revista de Cultura Digital Y Movimientos Sociales, 19(2), 133-141. https://doi.org/10.5209/tekn.76435